ST’s advanced semiconductor technology reduces the space required on PCBs. By integrating in a single-package the matching, filtering and protection functions usually implemented with discrete components, ST provides the flexibility to expand the number of functionalities of the end product or to create a smaller device. ST’s
Integrated Passive Devices (IPD) for RF applications,
ECMF™ series for high-speed lines and
ESD suppressors housed in micro-packages provide the highest level of integration.
One of the latest advanced devices joining ST’s micro-package families is the world’s smallest single-line TVS, the ESDAVLC6-1BV2, in a 01005 surface-mount package to protect sensitive circuitry against voltage surges.